Man. Anodic Bond process flow
1. Load 1st substrate
2. Wedge error compensation (WEC) between substrate and bond tool
3. Move cover into separation and adjust objectives to substrate pattern
4. Move cover into contact, fix 1st substrate with vacuum on bond tool and adjust crosshairs
5. Move cover up and load 2nd substrate
6. Use stage to pre-adjust the 2nd substrate to the crosshair of the 1st substrate before Wedge compensation (WEC)
7. Insert separations flags
8. Wedge compensation (WEC) between 1st and 2nd substrate
9. Move cover into separation and use stage to fine adjust the 2nd substrate to the crosshair from the 1st substrate
10. Move cover into contact and fix 2 substrates with clamps
11. Remove bond tool top
