Wafer Bond Aligner Standard Operating Procedure

Updated on 10/14/2014

Note:

Substrate size: QNF currently has tooling for bonding 4" diameter substrate/wafers. Tooling for other substrate sizes can be purchased from EVG.
Maximum stack height: 4.5 mm
Range of alignment: X, Y ± 5.0 mm
Alignment accuracy:
- 0.5 um for glass/silicon
- 1.0 um for silicon/silicon
Contact force: 1-40 N

1 Log-in

2 Open Recipe

3 Start Process

4 Load Bond Tool

5 Load Top Wafer

6 Alignment Process

6.1 Crosshair Process Mode

6.2 Overlay Process Mode

6.3 Transparent Process Mode

7 Unload Bond Tool

8 Stand By

9 Take Bond Tool to EVG510

10 Supplemental Documents

1. Log-in

Note: If the following EVG Explorer is shown on the screen, then double-click the "EV6XX" icon to open the log-in window.

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1. Click "Login" in the menu

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2. Log-in dialog box shows up.

3. Type user name and password, and click the "Login" button.

2. Open Recipe

1. The following window shows up.

2. Open the "SI ba.rcp" window.

Note: This recipe is designed along an Anodic Bonding process flow of silicon/glass or silicon/silicon, but it also works for most of alignment procedures.

3. Set the parameters in the "SI ba.rcp" window.

Note: The detail of the parameters is shown in Wafer Bond Aligner Recipes.

3. Start Process

1. Choose the process mode (Crosshair, Overlay, or Transparent) in the recipe window.

The detail of each operating procedure is shown below.

2. Click the "RUN" button in the recipe window.

3. The process window is opened.

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4. Click the "Continue" button on the bottom side.

5. The message and the picture on the bottom side change in the following:

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6. Click the "Continue" button on the bottom side.

7. Move the tray out manually.

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4. Load Bond Tool

1. When the tray is in position, the next message shows up.

2. Insert the bond tool, which is also used on EVG510 wafer bonder, onto the EVG620 bond aligner.

3. Click the "Continue" button.

4. Ensure that the clamp positions are opened.

5. Click the "Continue" button.

6. The spacers are set to be in the out-position.

7. Click the "Continue" button.

8. Since the chuck is inserted and the vacuum is connected already, as a default setting, click the "Continue" button.

5. Load Top Wafer

1. Insert the ruler, and click the "Continue" button.

2. Insert the bond glass template, and click the "Continue" button.

Note: Ensure that the top side is up, and that the template is aligned well with the chuck.

3. Load a top wafer on the template, and click the "Continue" button.

Note: Ensure that the side of the alignment marks is down.

4. Remove the ruler, and click the "Continue" button.

Note: If the template is set correctly, the wafer would not be moved by vacuum.

5. Move the tray in manually.

6. When the tray is in position, the next message shows up.

7. Move three X-, Y-, and theta-stage moving micrometers to the position of 5.0 mm, and click the "Continue" button.

8. Wait until wadge compensation is done.

6. Alignment Process

6.1 Crosshair Process Mode

6.2 Overlay Process Mode

6.3 Transparent Process Mode

7. Unload Bond Tool

1. Close the clamp positions.

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2. Remove Bond tool, and click the "Continue" button.

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3. Flip over the bond tool, and put it on the bench.

4. Move the tray out manually.

5. When the tray is in position, the message of "End of Process" shows up.

If you want to make another bond alignment, then click the "Continue" button.
If you finish the alignment, then click the "Exit" button on the right bottom side.

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